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Tuesday, April 28, 2020 | History

2 edition of Interdiffusion of electrodeposits with basis metals found in the catalog.

Interdiffusion of electrodeposits with basis metals

H J. Read

Interdiffusion of electrodeposits with basis metals

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  • 11 Currently reading

Published by American Electroplaters" Society in East Orange (N.J.) .
Written in English


Edition Notes

Statementby H.J. Read and W.P. Minnear.
SeriesResearch report -- no. 62.
ContributionsMinnear, W P., American Electroplaters" Society.
ID Numbers
Open LibraryOL20307456M


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Interdiffusion of electrodeposits with basis metals by H J. Read Download PDF EPUB FB2

X To inhibit interdiffusion between the basis metal and the gold top coat (for example, silver Interdiffusion of electrodeposits with basis metals book copper), which might produce a weak alloy or intermetallic compound at the interface.

X Levelling Layer—To produce a smoother surface than the basis metal in order to ensure a lower porosity gold top plate (for example, levelling nickel over a rough substrate) › 百度文库 › 互联网. Also see Electroplating shall be applied after all basis metal heat treatments and mechanical operations have been completed.

Appearance—Tin coatings shall have the characteristic appearance, including surface texture (), for the process  › 百度文库 › 语言/资格考试. The interdiffusion of electrodeposited Ni, Co and Co-W with Cu substrate were studied, at temperature ranging from to °C, using energy dispersive X-ray spectroscopy (EDS).

Chemical interdiffusion coefficients were calculated using the Boltzmann-Matano ://   Interdiffusion of Electrodeposits With Basis Metals AES Research Report # 5 pp Interfinish Interdiffusion of electrodeposits with basis metals book Proceedings Metal Interdiffusion of electrodeposits with basis metals book Society of JapanProceedings - Interfinish International Microelectronics Conference IPC Proceedings - IPC Int'l Seminar on Nutrient Control in Municipal Wastewater Effluent - 3 volumes EPA Book Four aspects of material science pertinent to electroplating are considered in this, the text of the 23rd William Blum Lecture, Interdiffusion of electrodeposits with basis metals book by the recipient of the AES Scientific Achievement Award.

The discussion addresses the ways in which epitaxy, twinning, dislocations and nucleation and growth of electrodeposits determine the deposit structure, which, in turn, is influenced by the The annealing behavior of palladium-nickel alloy deposits in the range of to percent Pd-Ni can be utilized to produce a ductile electrodeposit amenable to stamping and forming of   The book contains a number of photographs of structures of electrodeposits and data on properties.

In the 's Read extended this coverage by showing the remarkable range of structures and properties that can be achieved by electrodepositing a given metal in a variety of ways (9,lO).

In more recent times ( and )~chemlaba/Files/Electrodeposition/_pdf. The AES Gold Medal Award was given to I.V. Kadija and his co-workers for the Best Paper appearing in Plating and Surface Finishing in Their work dealt with the use of palladium in electronics finishing in the s. This paper covered the evaluation of such finishes for :// Electrodeposits present a polycrystalline character with coexistence of face-centred cubic (fcc) and hexagonal close-packed (hcp) structures.

Magnetoresistance effects as high as 8% were observed The performance characteristics of hermetic D cells with and electrolyte salts were found to be quite comparable to the cells with electrolyte salt when tested fresh. After storage at 72°C the cells with salt showed improved voltage‐delay characteristics at −30°C.

SEM studies showed the Li anode film to be relatively thin, porous and possibly mechanically weak, and consists of uniformly A great deal of progress has been made in the development of materials, their application to structures, and their adaptation to a variety of systems and integrated across a wide range of industrial applications.

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